EDX and Tilt Upgrade Available

Resolution at 1 KeV

Wafers per hour

Defects per hour
EDX Resolution

Applied Materials’ SEMVision G3 family, the industry’s fastest, most sensitive line of defect review and analysis tools for 65/45nm manufacturing and beyond. The new line of three systems sets the industry benchmark with 30nm sensitivity and throughputs of up to 1,800 defects per hour. Used in an optimized defect review strategy, these systems can accelerate customers’ production ramp by rapidly identifying the root cause of systematic and yield-limiting defects.

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The SEMVision product line includes the new Applied SEMVision G3 HP (high productivity) tool, the most productive system available for performing routine defect review and production process monitoring. The G3 HP provides a significant reduction in cost of ownership over previous tools, achieving world-class efficiency and lowest cost per defect.

The new Applied SEMVision G3 classic is the production workhorse system for volume defect review and material analysis, offering tilt and EDX(1) capabilities. As the ultimate system for inline root cause analysis, the recently introduced Applied SEMVision G3 FIB system, with integrated focused ion beam technology, provides complete capability for embedded defect and electrical failure analysis. 

All three systems share the same proven platform, including the capability to share recipes, a common user interface and algorithms. This unique commonality shortens set-up time through extensive recipe sharing and provides high availability. 

Applied’s SEMVision technology, which features industry innovations such as multi-perspective imaging, materials analysis and inline FIB, has rapidly expanded the use of SEMs(for defect analysis in manufacturing. The need for defect review has greatly increased and is now the third largest segment in the defect reduction market. Applied, with an installed base of nearly 700 SEMVision systems, is the leading supplier of this technology. 

The new SEMVision family addresses the trend to achieve faster time to Resolution by harnessing the combined power of process and inspection expertise to dramatically cut the time and cost of resolving yield-limiting defects. 


General Info

Detail Configuration

Wafer System

Robot Maker: Brooks

Sight Source: SE-Gun Tip

Resolution: 4.0nm



Wafer Handling

Loader: AMAT ADO with RFID / OCLP / SMIF

Wafer Size: 300mm / 200mm


FFU with ULPA Filter

SEM column

EDX column

45 Deg column Tilt

Wafer Rotation option included

Stage wafer holder ESC 

ETU 300mm / 200mm

ITU 300mm / 200mm


Optical Microscope X5 ,X20, X100

Software and Workstation

Software version

WS, IP/ODC SW, MEC, WHC): v5.4.500( latest version)

WorkStation SGI FULE

Software version (EDX): VTG_5.4.500 (latest  version)

TFT LCD Monitors

IPU G3/G2 

System performance

Pal (On the OTW, cassette / Slot 1: Delta X= 500 µms; Delta Y= 500 µm

ITU Repeatability: Delta X and Delta Y < 20 µm

Stage accuracy: Delta X and Delta Y < 1,5 µm

MTR: Delta X= 50; Delta Y= 30 µms



Focus map / focus offset: 90% of the defect with Delta Z < 3 µms

Automatic defect offset/XY Map: 95% of the defects with Delta X < 1.5 µm and Delta Y < 1.5 µm

EDX resolution 4nm 

Wafer throughput: 15 Wafers / Hours

Defects throughput: >1800 Defects / Hour

Cleanliness front side: 

0.013 PWP / cm2 > size at 0.2 µm


Largest load ampere rating: 8 A

Full load current: 10 A

Interrupt current: 10,000 Amps I. C.

Supply voltage: 1-120 VAC, 1-Ph, 3-wires

208 V, 3-Ph, 5-wires, 50/60 Hz