NANOSEM 3D™

*Multiple Systems Available











The NanoSEM 3D system’s exceptional in-line accuracy and process control eliminate more time-consuming and costly off-line wafer cross-sectioning while helping chipmakers to streamline process development, improve device performance and yield, and shorten ramp times to high-volume production.


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General Info

Specifications

Software Options

• Slope Reconstruction

• CH Analysis

• Profile Grade

• Discrete Inspection

• Defect Review

• ARAMS (ES8

Power Requirements

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